An Approach for the Characterization of the Adhesion Strength Degradation of Semiconductor's Thin Film Metallizations

Internally funded project


Start date : 01.09.2021

End date : 30.09.2023

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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

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To

Abstract

Journal

Combined experimental and numerical approach for investigating the mechanical degradation of the interface between thin film metallization and Si-substrate after temperature cycling test (2020) Zhao D, Letz S, Yu Z, Schletz A, März M Journal article, Original article A Method for the Characterization of Adhesion Strength Degradation of Thin Films on Si-Substrate under thermal cycling test (2020) Zhao D, Letz S, Schletz A, März M Conference contribution, Conference Contribution