Technologies and Processes for Hetero-Integration of Power Electronic Systems (MIIMOSYS)

Third Party Funds Group - Overall project


Acronym: MIIMOSYS

Start date : 01.08.2017

End date : 31.12.2020

Extension date: 30.09.2021

Website: https://www.elektronikforschung.de/projekte/miimosys

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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year

From
To

Abstract

Journal

Combined experimental and numerical approach for investigating the mechanical degradation of the interface between thin film metallization and Si-substrate after temperature cycling test (2020) Zhao D, Letz S, Yu Z, Schletz A, März M Journal article, Original article Reliability of silver direct bonding in thermal cycling tests (2020) Yu Z, Zeng W, Zhao D, Zhang Z, Bayer CF, Schletz A, März M Conference contribution A Method for the Characterization of Adhesion Strength Degradation of Thin Films on Si-Substrate under thermal cycling test (2020) Zhao D, Letz S, Schletz A, März M Conference contribution, Conference Contribution