Dynamic Characterization of Molded Devices and Fundamental Investigations on Reliability (ZuGaNG)
Third Party Funds Group - Sub project
Acronym:
ZuGaNG
Start date :
01.04.2014
End date :
31.03.2017
Extension date:
30.06.2017
Fundamental Efficiency Limits in Power Electronic Systems (2016)
Heckel T, Rettner C, März M
Conference contribution, Conference Contribution
Slew rate control of a 600 V 55 mΩ GaN cascode (2016)
Endruschat A, Heckel T, Reiner R, Waltereit P, Quay R, Ambacher O, März M, et al.
Conference contribution, Conference Contribution
A Novel Charge Based SPICE Model for Nonlinear Device Capacitances (2015)
Heckel T, Frey L
Conference contribution, Conference Contribution
High Power Density Automotive Converters using SiC or GaN Power Devices (2015)
Eckardt B, Heckel T
Conference contribution, Conference Contribution