Aarief Hussain Syed Khaja

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0000-0002-7468-7867

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Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

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Publications

(29)

Advanced substrate and packaging concepts for compact system integration with additive manufacturing technologies for high temperature applications (2015) Syed Khaja AH, Schwarz D, Franke J Conference contribution, Conference Contribution Characterization and reliability of paste based thin-film Sn-Cu TLPS joints for high temperature power electronics (2015) Syed Khaja AH, Franke J Conference contribution, Conference Contribution A Comprehensive Study on the Automation Potentials and Complexities of Advanced and Alternative Die-Attach Technologies for Power Electronic Applications (2015) Syed Khaja AH, Kästle C, Müller M, Franke J Journal article Investigations on advanced soldering mechanisms for transient liquid phase soldering (TLPS) in power electronics (2014) Syed Khaja AH, Franke J Conference contribution, Conference Contribution Design and solder process optimization in MID technology for high power applications (2014) Syed Khaja AH, Kästle C Authored book, Volume of book series Energy efficiency investigation on high-pressure convection reflow soldering in electronics production (2014) Esfandyari A, Syed Khaja AH, Javied T, Franke J Authored book, Volume of book series Investigations on Ultrasonic Copper Wire Wedge Bonding for Power Electronics (2013) Kästle C, Syed Khaja AH, Reinhardt A, Franke J Conference contribution, Conference Contribution Optimized thin-film diffusion soldering for power-electronics production (2013) Syed Khaja AH, Kästle C, Reinhardt A, Franke J Conference contribution, Conference Contribution Reliable packaging technologies for power electronics: Diffusion soldering and heavy copper wire bonding (2013) Syed Khaja AH, Kästle C, Franke J Conference contribution, Conference Contribution

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