Aarief Hussain Syed Khaja

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

High temperature thermal cycling reliability of silver sintered and electroplated tin based transient liquid phase joints (2019) Hamilton DP, Syed Khaja AH, Franke J, Mawby P Conference contribution Process optimization in transient liquid phase soldering (TLPS) for an efficient and economical production of high temperature power electronics (2019) Syed Khaja AH, Franke J Conference contribution Prototyping and Production of High-temperature Power Electronic Substrates through Additive Manufacturing Processes (2017) Stoll T, Syed Khaja AH, Franke J Journal article Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit Carriers (2017) Kästle C, Syed Khaja AH, Franke J Journal article Simulation, Optimization and Experimental Verification of the Over-Pressure Reflow Soldering Process (2017) Esfandyari A, Bachy B, Raithel S, Syed Khaja AH, Franke J Conference contribution Feasibility Investigations on Selective Laser Melting for the Development of Microchannel Cooling in Power Electronics (2017) Syed Khaja AH, Perinan Freire A, Kästle C, Franke J Conference contribution, Conference Contribution Investigations on Wire Bonding Capability of Selective Laser Melted Structures (2016) Kästle C, Syed Khaja AH, Franke J Conference contribution, Conference Contribution Production and Characterization of High-temperature Substrates through Selective Laser Melting (SLM) for Power Electronics (2016) Syed Khaja AH, Perez P, Franke J Conference contribution Characterization and Optimization of Sn-Cu TLPS Interconnects for High Temperature Power Electronics through In-Situ-X-Ray Investigations (2016) Syed Khaja AH, Klemm A, Zerna T, Franke J Conference contribution, Conference Contribution Is selective laser melting (SLM) an alternative for high-temperature mechatronic integrated devices? methodology, hurdles and prospects (2016) Syed Khaja AH, Walawski D, Stoll T, Franke J Conference contribution, Conference Contribution