Aarief Hussain Syed Khaja

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

Selective Laser Melting for Additive Manufacturing of High-Temperature Ceramic Circuit Carriers (2016) Syed Khaja AH, Franke J Conference contribution, Conference Contribution Investigations in Selective Laser Melting as Manufacturing Technology for the Production of High-temperature Mechatronic Integrated Devices (2016) Syed Khaja AH, Stoll T, Franke J Conference contribution Feasibility Studies on Selective Laser Melting of Copper Powders for the Development of High-temperature Circuit Carriers (2016) Syed Khaja AH, Kästle C, Franke J Conference contribution, Conference Contribution Influential parameters in the development of Transient Liquid Phase Soldering (TLPS) as a new interconnect system for high power lighting applications (2015) Syed Khaja AH, Franke J Conference contribution, Conference Contribution Investigations in the optimization of power electronics packaging through additive plasma technology (2015) Franke J, Syed Khaja AH, Schramm R, Ochs R Conference contribution, Conference Contribution A novel approach for thin-film Ag-sintering process through Aerosol Jet Printing in power electronics (2015) Syed Khaja AH, Hörber J, Gruber C, Franke J Conference contribution, Conference Contribution An exergy-based analysis of temperature profiles for an over-pressure reflow oven technology (2015) Esfandyari A, Landskrone T, Syed Khaja AH, Franke J Conference contribution, Conference Contribution Advanced substrate and packaging concepts for compact system integration with additive manufacturing technologies for high temperature applications (2015) Syed Khaja AH, Schwarz D, Franke J Conference contribution, Conference Contribution Characterization and reliability of paste based thin-film Sn-Cu TLPS joints for high temperature power electronics (2015) Syed Khaja AH, Franke J Conference contribution, Conference Contribution A Comprehensive Study on the Automation Potentials and Complexities of Advanced and Alternative Die-Attach Technologies for Power Electronic Applications (2015) Syed Khaja AH, Kästle C, Müller M, Franke J Journal article