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Aarief Hussain Syed Khaja
Scopus Author ID:
56431150000
Orcid ID:
0000-0002-7468-7867
Thomson Researcher ID:
M-2114-2013
List of publications:
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Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Award(s)
(1)
Publications
(26)
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Journal article
Journal article
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Book chapter / Article in edited volumes
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Authored book
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Translation
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Thesis
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Conference contribution
Conference contribution
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Other publication type
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Unpublished / Preprint
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Selective Laser Melting for Additive Manufacturing of High-Temperature Ceramic Circuit Carriers (2016)
Syed Khaja AH, Franke J
Conference contribution, Conference Contribution
Investigations in Selective Laser Melting as Manufacturing Technology for the Production of High-temperature Mechatronic Integrated Devices (2016)
Syed Khaja AH, Stoll T, Franke J
Conference contribution
Feasibility Studies on Selective Laser Melting of Copper Powders for the Development of High-temperature Circuit Carriers (2016)
Syed Khaja AH, Kästle C, Franke J
Conference contribution, Conference Contribution
Influential parameters in the development of Transient Liquid Phase Soldering (TLPS) as a new interconnect system for high power lighting applications (2015)
Syed Khaja AH, Franke J
Conference contribution, Conference Contribution
Investigations in the optimization of power electronics packaging through additive plasma technology (2015)
Franke J, Syed Khaja AH, Schramm R, Ochs R
Conference contribution, Conference Contribution
A novel approach for thin-film Ag-sintering process through Aerosol Jet Printing in power electronics (2015)
Syed Khaja AH, Hörber J, Gruber C, Franke J
Conference contribution, Conference Contribution
An exergy-based analysis of temperature profiles for an over-pressure reflow oven technology (2015)
Esfandyari A, Landskrone T, Syed Khaja AH, Franke J
Conference contribution, Conference Contribution
Advanced substrate and packaging concepts for compact system integration with additive manufacturing technologies for high temperature applications (2015)
Syed Khaja AH, Schwarz D, Franke J
Conference contribution, Conference Contribution
Characterization and reliability of paste based thin-film Sn-Cu TLPS joints for high temperature power electronics (2015)
Syed Khaja AH, Franke J
Conference contribution, Conference Contribution
A Comprehensive Study on the Automation Potentials and Complexities of Advanced and Alternative Die-Attach Technologies for Power Electronic Applications (2015)
Syed Khaja AH, Kästle C, Müller M, Franke J
Journal article
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