Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Research facility
Location:
Berlin,
Germany (DE)
ISNI: 0000 0004 0374 3192
ROR: https://ror.org/031aqk326
In-situ characterization of thin polyimide films used for microelectronic packaging (2018)
Windrich F, Malanin M, Bittrich E, Schwarz A, Eichhorn KJ, Voit B
Conference contribution
In-situ imidization analysis in microscale thin films of an ester-type photosensitive polyimide for microelectronic packaging applications (2016)
Windrich F, Kappert EJ, Malanin M, Eichhorn KJ, Haeussler L, Benes NE, Voit B
Journal article
Rapid Scan In-Situ FT-IR Curing Studies of Low-Temperature Cure Thin Film Polymer Dielectrics in Solid State (2016)
Windrich F, Malanin M, Eichhorn KJ, Voit B
Conference contribution
Low-temperature photosensitive polyimide processing for use in 3D integration technologies (2014)
Windrich F, Malanin M, Eichhorn KJ, Voit B, Lang KD
Conference contribution