Multi-Partner Project: A Holistic and Open-Source Approach to Efficient, Secure and Reliable AI Hardware Deployment in DI-EDAI

Sotiropoulos G, Frombach F, Höfer J, Harbaum T, Becker J, Thorøe HI, Meyers V, Tahoori M, Demirdag Z, Sikal MB, Nassar H, Khdr H, Henkel J, Wolters C, van Kempen P, Geier J, Schlichtmann U, Sesli B, Sabih M, Wittmann J, Hannig F, Teich J, Steiner L, Wehn N, Shelkamy Ali M, Schmitz P, Kunz W, Kögler S, Sigl G (2026)

Publication Language: English

Publication Type: Conference contribution, Conference Contribution

Publication year: 2026

Publisher: IEEE

Pages Range: 1-7

Conference Proceedings Title: Proceedings of the Conference on Design, Automation and Test in Europe (DATE)

Event location: Verona

ISBN: 978-3-9826741-1-7

DOI: 10.23919/DATE69613.2026.11539555

Authors with CRIS profile

Related research project(s)

Involved external institutions

Rheinland-Pfälzische Technische Universität Kaiserslautern-Landau (RPTU) Germany (DE) Technische Universität München (TUM) Germany (DE) Karlsruhe Institute of Technology (KIT) Germany (DE)

How to cite

APA:

Sotiropoulos, G., Frombach, F., Höfer, J., Harbaum, T., Becker, J., Thorøe, H.I.,... Sigl, G. (2026). Multi-Partner Project: A Holistic and Open-Source Approach to Efficient, Secure and Reliable AI Hardware Deployment in DI-EDAI. In Proceedings of the Conference on Design, Automation and Test in Europe (DATE) (pp. 1-7). Verona, IT: IEEE.

MLA:

Sotiropoulos, Georgios, et al. "Multi-Partner Project: A Holistic and Open-Source Approach to Efficient, Secure and Reliable AI Hardware Deployment in DI-EDAI." Proceedings of the Conference on Design, Automation and Test in Europe (DATE), Verona IEEE, 2026. 1-7.

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