From 3D Point Cloud Data to Ray-tracing Multi-band Simulations in Industrial Scenario
Niu H, Dupleich D, Volker-Schoneberg Y, Ebert A, Muller R, Eichinger J, Artemenko A, Galdo GD, Thoma RS (2022)
Publication Type: Conference contribution
Publication year: 2022
Publisher: Institute of Electrical and Electronics Engineers Inc.
Book Volume: 2022-June
Conference Proceedings Title: IEEE Vehicular Technology Conference
Event location: Helsinki, FIN
ISBN: 9781665482431
DOI: 10.1109/VTC2022-Spring54318.2022.9861002
Abstract
In this paper, we present the ray tracing (RT) simulation in the 3D model of one highly dense clutter industrial hall, which is scanned by laser scanner and reconstructed based on accurate point cloud. The whole processing chain from the scanning of the physical environment to running the simulation is presented in detail. To validate the simulation results, the synthetic channel characteristics and large-scale parameters, including delay spread (DS), angular spread (AS) and path loss (PL), are compared with those obtained from channel sounding measurement in both LOS and NLOS cases, at 6.75 GHz, 30 GHz and 60 GHz. The simulation results show that some scatters are significant in all bands and may be well identified and tracked. This indicates that our target to generate a deterministic channel model or a hybrid channel model at multi-band for industrial scenario may be possible.
Involved external institutions
Technische Universität Ilmenau
Germany (DE)
HUAWEI TECHNOLOGIES Deutschland GmbH
Germany (DE)
Robert Bosch GmbH
Germany (DE)
Germany (DE)
HUAWEI TECHNOLOGIES Deutschland GmbH
Germany (DE)
Robert Bosch GmbH
Germany (DE)
How to cite
APA:
Niu, H., Dupleich, D., Volker-Schoneberg, Y., Ebert, A., Muller, R., Eichinger, J.,... Thoma, R.S. (2022). From 3D Point Cloud Data to Ray-tracing Multi-band Simulations in Industrial Scenario. In IEEE Vehicular Technology Conference. Helsinki, FIN: Institute of Electrical and Electronics Engineers Inc..
MLA:
Niu, Han, et al. "From 3D Point Cloud Data to Ray-tracing Multi-band Simulations in Industrial Scenario." Proceedings of the 95th IEEE Vehicular Technology Conference - Spring, VTC 2022-Spring, Helsinki, FIN Institute of Electrical and Electronics Engineers Inc., 2022.
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