Innovations and Challenges in Laser Direct Structured Mechatronic Integrated Devices for Aviation: Material Development, Component Design, and Additive Manufacturing

Piechulek N, Ankenbrand M, Xu L, Fröhlich J, Nguyen H, Bründl P, Franke J (2024)

Publication Type: Conference contribution, Conference Contribution

Publication year: 2024

Publisher: Institute of Electrical and Electronics Engineers Inc.

Pages Range: 526-533

Conference Proceedings Title: Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024

Event location: Singapore, SGP

ISBN: 9798331522001

DOI: 10.1109/EPTC62800.2024.10909947

Abstract

The aviation industry is striving to improve eco-efficiency by reducing the weight of aircraft and thus lowering CO2 emissions during operation. This paper investigates whether three-dimensional mechatronic integrated devices (3D-MIDs) can contribute to aircraft cabin weight reduction through laser direct structuring (LDS). The development of LDS-compatible materials that meet aerospace requirements and advanced manufacturing techniques should result in lighter components. The Passenger Service Unit (PSU) demonstrator is used to explore the potential of LDS-MIDs to achieve significant weight savings and ultimately improve the environmental footprint of modern aircraft.

Authors with CRIS profile

Niklas Piechulek Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Markus Ankenbrand Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Jan Fröhlich Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Patrick Bründl Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

How to cite

APA:

Piechulek, N., Ankenbrand, M., Xu, L., Fröhlich, J., Nguyen, H., Bründl, P., & Franke, J. (2024). Innovations and Challenges in Laser Direct Structured Mechatronic Integrated Devices for Aviation: Material Development, Component Design, and Additive Manufacturing. In Sunmi Shin, Chin Hock Toh, Yeow Kheng Lim, Vivek Chidambaram, King Jien Chui (Eds.), Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024 (pp. 526-533). Singapore, SGP: Institute of Electrical and Electronics Engineers Inc..

MLA:

Piechulek, Niklas, et al. "Innovations and Challenges in Laser Direct Structured Mechatronic Integrated Devices for Aviation: Material Development, Component Design, and Additive Manufacturing." Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024, Singapore, SGP Ed. Sunmi Shin, Chin Hock Toh, Yeow Kheng Lim, Vivek Chidambaram, King Jien Chui, Institute of Electrical and Electronics Engineers Inc., 2024. 526-533.

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