Ankenbrand M, Piechulek N, Mutlu E, Franke J (2024)
Publication Type: Conference contribution, Conference Contribution
Publication year: 2024
Publisher: Institute of Electrical and Electronics Engineers Inc.
Pages Range: 505-508
Conference Proceedings Title: Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024
Event location: Singapore, SGP
ISBN: 9798331522001
DOI: 10.1109/EPTC62800.2024.10909948
Additive manufactured electronics allows the development of highly integrated and personalized products. This work investigates the feasibility and performance of fully additive manufactured light bulbs that operate at mains voltage (230 V AC). The printing of the conductive traces, curing and pick & place of SMT components are combined in a single machine. Particular focus lies on the interconnection technology for the electronic components by printing conductive paste and dispensing adhesives. Furthermore, the thermal management and the reliability of the light bulbs are investigated.
APA:
Ankenbrand, M., Piechulek, N., Mutlu, E., & Franke, J. (2024). Feasibility and Performance of Fully Additive Manufactured Light Bulbs. In Sunmi Shin, Chin Hock Toh, Yeow Kheng Lim, Vivek Chidambaram, King Jien Chui (Eds.), Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024 (pp. 505-508). Singapore, SGP: Institute of Electrical and Electronics Engineers Inc..
MLA:
Ankenbrand, Markus, et al. "Feasibility and Performance of Fully Additive Manufactured Light Bulbs." Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024, Singapore, SGP Ed. Sunmi Shin, Chin Hock Toh, Yeow Kheng Lim, Vivek Chidambaram, King Jien Chui, Institute of Electrical and Electronics Engineers Inc., 2024. 505-508.
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