Selzam JH, Enslein N, Gross D, Hanenkamp N (2025)
Publication Type: Conference contribution
Publication year: 2025
Publisher: Springer Science and Business Media Deutschland GmbH
Series: Lecture Notes in Mechanical Engineering
City/Town: Cham
Pages Range: 684-692
Conference Proceedings Title: Lecture Notes in Mechanical Engineering
Event location: Buenos Aires, ARG
ISBN: 9783031774287
URI: https://link.springer.com/chapter/10.1007/978-3-031-77429-4_76
DOI: 10.1007/978-3-031-77429-4_76
Open Access Link: https://link.springer.com/chapter/10.1007/978-3-031-77429-4_76
As well as producing contamination-free parts, dry machining is a sustainable alternative to conventional machining processes using metalworking fluids. Despite these benefits, chip breaking and chip removal are challenges in dry machining processes, particularly when turning ductile materials, which are known for continuous chip formation and therefore long chips. Due to their tendency to become entangled around machine components, these chips have to be removed manually, posing a risk to productivity and operator health. Recent studies have demonstrated the effectiveness of pulsed high-pressure emulsion cooling for chip breaking. This paper aims to transfer these findings to sustainable dry machining and investigates the influence of pulsed high-pressure cryogenic jet cooling on chip breaking and chip removal. Therefore, liquid CO
APA:
Selzam, J.H., Enslein, N., Gross, D., & Hanenkamp, N. (2025). Sustainable Dry Turning of Aluminum Alloys Using Pulsed High-Pressure Cryogenic Jet Cooling. In Holger Kohl, Günther Seliger, Franz Dietrich, Sebastián Mur (Eds.), Lecture Notes in Mechanical Engineering (pp. 684-692). Buenos Aires, ARG: Cham: Springer Science and Business Media Deutschland GmbH.
MLA:
Selzam, Jan Harald, et al. "Sustainable Dry Turning of Aluminum Alloys Using Pulsed High-Pressure Cryogenic Jet Cooling." Proceedings of the 19th Global Conference on Sustainable Manufacturing, GCSM 2023, Buenos Aires, ARG Ed. Holger Kohl, Günther Seliger, Franz Dietrich, Sebastián Mur, Cham: Springer Science and Business Media Deutschland GmbH, 2025. 684-692.
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