Agreement Quantification of a Numerical EMC Computer Model and Test Infrastructure for the HV Power Train Emissions for an Electric Vehicle
Stöhr T, Rasek GA, Murthy NS (2023)
Publication Language: English
Publication Type: Conference contribution
Publication year: 2023
Publisher: Institute of Electrical and Electronics Engineers Inc.
Conference Proceedings Title: 2023 International Symposium on Electromagnetic Compatibility – EMC Europe
Event location: Krakow
ISBN: 979-8-3503-2401-3
DOI: 10.1109/EMCEurope57790.2023.10274221
Abstract
A numerical computer model for EMC of the electric power train is not aimed to be a self-fulfilling proficiency but shall be used over different phases of the automotive development process. It starts with requests on rough data in the early development phase and potentially ends with a digital twin. For each development stage, restarting is not realistic. However, numerical model and hardware progression can be done in parallel. Here the achieved accuracy of the numerical computer model is quantified for the agreement with experimental results for an industrial automotive power train for an electric vehicle. The accuracy of the model is compared to the influences of boundary conditions in EMC validation to judge the model accuracy in the global context.
Involved external institutions
Germany (DE)How to cite
APA:
Stöhr, T., Rasek, G.A., & Murthy, N.S. (2023). Agreement Quantification of a Numerical EMC Computer Model and Test Infrastructure for the HV Power Train Emissions for an Electric Vehicle. In 2023 International Symposium on Electromagnetic Compatibility – EMC Europe. Krakow, PL: Institute of Electrical and Electronics Engineers Inc..
MLA:
Stöhr, Thomas, Guido A. Rasek, and Nagapoornima S. Murthy. "Agreement Quantification of a Numerical EMC Computer Model and Test Infrastructure for the HV Power Train Emissions for an Electric Vehicle." Proceedings of the 2023 International Symposium on Electromagnetic Compatibility - EMC Europe, EMC Europe 2023, Krakow Institute of Electrical and Electronics Engineers Inc., 2023.
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