Multi Cycle and Material Deposition for Spatial Atomic Layer Deposition Process

Varga AC, Carnoy M, Kundrata I, Plakhotnyuk M, Bachmann J (2023)


Publication Type: Conference contribution

Publication year: 2023

Publisher: Institute of Electrical and Electronics Engineers Inc.

Pages Range: 248-249

Conference Proceedings Title: 2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023

Event location: Paestum, ITA

ISBN: 9798350335460

DOI: 10.1109/NMDC57951.2023.10344252

Abstract

Spatial Atomic Layer Deposition (sALD) offers a unique opportunity for localized deposition due to its physical separation and isolation of precursor and co-reagent dosing.[1] However, although simple in theory, due to well-developed examples of sALD, in practice miniaturization of sALD requires substantial effort into the creation of suitable micro-nozzles.[1] Uniquely, ATLANT 3D has developed proprietary sALD micronozzles, called microreactor Direct Atomic Layer Processing - μDALP™.

Involved external institutions

How to cite

APA:

Varga, A.C., Carnoy, M., Kundrata, I., Plakhotnyuk, M., & Bachmann, J. (2023). Multi Cycle and Material Deposition for Spatial Atomic Layer Deposition Process. In 2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023 (pp. 248-249). Paestum, ITA: Institute of Electrical and Electronics Engineers Inc..

MLA:

Varga, Atilla C., et al. "Multi Cycle and Material Deposition for Spatial Atomic Layer Deposition Process." Proceedings of the 18th IEEE Nanotechnology Materials and Devices Conference, NMDC 2023, Paestum, ITA Institute of Electrical and Electronics Engineers Inc., 2023. 248-249.

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