Multi Cycle and Material Deposition for Spatial Atomic Layer Deposition Process
Varga AC, Carnoy M, Kundrata I, Plakhotnyuk M, Bachmann J (2023)
Publication Type: Conference contribution
Publication year: 2023
Publisher: Institute of Electrical and Electronics Engineers Inc.
Pages Range: 248-249
Conference Proceedings Title: 2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023
Event location: Paestum, ITA
ISBN: 9798350335460
DOI: 10.1109/NMDC57951.2023.10344252
Abstract
Spatial Atomic Layer Deposition (sALD) offers a unique opportunity for localized deposition due to its physical separation and isolation of precursor and co-reagent dosing.[1] However, although simple in theory, due to well-developed examples of sALD, in practice miniaturization of sALD requires substantial effort into the creation of suitable micro-nozzles.[1] Uniquely, ATLANT 3D has developed proprietary sALD micronozzles, called microreactor Direct Atomic Layer Processing - μDALP™.
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APA:
Varga, A.C., Carnoy, M., Kundrata, I., Plakhotnyuk, M., & Bachmann, J. (2023). Multi Cycle and Material Deposition for Spatial Atomic Layer Deposition Process. In 2023 IEEE Nanotechnology Materials and Devices Conference, NMDC 2023 (pp. 248-249). Paestum, ITA: Institute of Electrical and Electronics Engineers Inc..
MLA:
Varga, Atilla C., et al. "Multi Cycle and Material Deposition for Spatial Atomic Layer Deposition Process." Proceedings of the 18th IEEE Nanotechnology Materials and Devices Conference, NMDC 2023, Paestum, ITA Institute of Electrical and Electronics Engineers Inc., 2023. 248-249.
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