Additive metallization of alumina with copper-titanium powder blends for power electronic applications

Hecht C, Häußler F, Schadow E, Stoll T, Sprenger M, Franke J (2023)

Publication Type: Journal article

Publication year: 2023

Journal

Book Volume: 2023

Pages Range: 129-134

Journal Issue: EMPC

DOI: 10.4071/001c.94698

Abstract

Additive manufacturing shows great potential to further increase the performance of power electronic modules through novel packaging concepts. Such an approach is the integrated manufacturing of metal-ceramic substrates by means of laser powder bed fusion of metals (PBF-LB/M). With this layered additive manufacturing process, planar ceramic substrates can be metallized and electrically functionalized for power electronic applications. In this paper Al2O3 ceramic substrates are metallized via PBF-LB/M by selectively melting applied powder layers with software defined geometries. The investigated powders are mixtures of copper and titanium powders with 1 wt.%, 5 wt.% and 10 wt.% titanium in order to enable bonding by creating a titanium-oxide reaction layer at the interface to the ceramic. Shear tests and microstructural investigations show that a subsequent heat treatment increases the adhesion and density of the metallization. By energy dispersive X-ray microscopy (EDX) the partial formation of reaction layers is detected.

Authors with CRIS profile

Involved external institutions

Technische Universität München (TUM) Germany (DE)

How to cite

APA:

Hecht, C., Häußler, F., Schadow, E., Stoll, T., Sprenger, M., & Franke, J. (2023). Additive metallization of alumina with copper-titanium powder blends for power electronic applications. Advancing Microelectronics, 2023(EMPC), 129-134. https://doi.org/10.4071/001c.94698

MLA:

Hecht, Christoph, et al. "Additive metallization of alumina with copper-titanium powder blends for power electronic applications." Advancing Microelectronics 2023.EMPC (2023): 129-134.

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