Assessment and improvement of adhesion of printed silver-based inks on alumina produced by fused filament fabrication

Utsch D, Sippel M, Voigt C, Häußler F, Franke J (2024)

Publication Type: Journal article

Publication year: 2024

Journal

Book Volume: 8

Article Number: 100067

DOI: 10.1016/j.pedc.2024.100067

Abstract

More efficient electronic systems need more temperature-stable substrate materials and more flexible production possibilities. Ceramics such as alumina can be used for 2D and 3D base bodies, since they provide better thermal properties than their polymeric counterparts and can be additively manufactured utilizing e.g. Fused Filament Fabrication. Proper functionalization can be achieved by applying methods of printed electronics. Here, adhesion of the functional ink to a substrate is a crucial issue and especially challenging on ceramic substrates. This contribution reached a noteworthy increase in this matter, using a modified silver-based ink with piezojet-printing, while preserving very low electrical resistance after convection sintering. Adhesion is determined by pull-off testing, based on ISO 4624. By the approach shown in this work, printed ceramics could become a more viable choice for use in functional electronic systems.

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How to cite

APA:

Utsch, D., Sippel, M., Voigt, C., Häußler, F., & Franke, J. (2024). Assessment and improvement of adhesion of printed silver-based inks on alumina produced by fused filament fabrication. Power Electronic Devices and Components, 8. https://doi.org/10.1016/j.pedc.2024.100067

MLA:

Utsch, Daniel, et al. "Assessment and improvement of adhesion of printed silver-based inks on alumina produced by fused filament fabrication." Power Electronic Devices and Components 8 (2024).

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