It's Tee Time: An Ultrabroadband Componentless Bias Tee: A Planar Ultrabroadband Componentless Bias Tee in Microstrip Line Technology

Kögel T, Scheder A, Meyl M, Sohr S, Vossiek M (2024)

Publication Type: Journal article

Publication year: 2024

Journal

IEEE Microwave Magazine Institute of Electrical and Electronics Engineers (IEEE)

Book Volume: 25

Pages Range: 65-71

Journal Issue: 6

DOI: 10.1109/MMM.2024.3378613

Abstract

With the trend toward ever-higher frequencies and continuously increasing bandwidth in communication for 5G and 6G as well as in the radar domain, the demand on broadband hardware components is rising accordingly [1]. Circuits that were initially considered simple have to be optimized further in order to meet challenging demands.

Authors with CRIS profile

Tobias Kögel Lehrstuhl für Hochfrequenztechnik André Scheder Lehrstuhl für Hochfrequenztechnik Martin Vossiek Lehrstuhl für Hochfrequenztechnik

Additional Organisation(s)

FAU Profilzentrum Licht.Materie.Quantentechnologien (FAU LMQ)

Involved external institutions

Rohde & Schwarz GmbH & Co. KG DE Germany (DE)

How to cite

APA:

Kögel, T., Scheder, A., Meyl, M., Sohr, S., & Vossiek, M. (2024). It's Tee Time: An Ultrabroadband Componentless Bias Tee: A Planar Ultrabroadband Componentless Bias Tee in Microstrip Line Technology. IEEE Microwave Magazine, 25(6), 65-71. https://doi.org/10.1109/MMM.2024.3378613

MLA:

Kögel, Tobias, et al. "It's Tee Time: An Ultrabroadband Componentless Bias Tee: A Planar Ultrabroadband Componentless Bias Tee in Microstrip Line Technology." IEEE Microwave Magazine 25.6 (2024): 65-71.

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