Creep transients during stress changes in ultrafine-grained copper

Kapoor R, Li Y, Wang JT, Blum W (2006)

Publication Language: English

Publication Type: Journal article

Publication year: 2006

Journal

Scripta Materialia Elsevier

Book Volume: 54

Pages Range: 1803-1807

Journal Issue: 10

DOI: 10.1016/j.scriptamat.2006.01.032

Abstract

Stress change tests were conducted on ultrafine-grained Cu in a region where the grain size is smaller than the steady state subgrain size. After stress reduction the normal creep transients were absent, confirming subgrain strengthening in conventional grain-sized materials and a lack of steady state subgrain structure in the ultrafine-grained materials. © 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Authors with CRIS profile

Wolfgang Blum Technische Fakultät

Additional Organisation(s)

Lehrstuhl für Werkstoffwissenschaften (Allgemeine Werkstoffeigenschaften)

Involved external institutions

Nanjing University of Science and Technology CN China (CN) Bhabha Atomic Research Center / भाभा परमाणु अनुसन्धान केंद्र (BARC) IN India (IN)

How to cite

APA:

Kapoor, R., Li, Y., Wang, J.T., & Blum, W. (2006). Creep transients during stress changes in ultrafine-grained copper. Scripta Materialia, 54(10), 1803-1807. https://doi.org/10.1016/j.scriptamat.2006.01.032

MLA:

Kapoor, R., et al. "Creep transients during stress changes in ultrafine-grained copper." Scripta Materialia 54.10 (2006): 1803-1807.

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