Ottinger B, Mathew A, König S, Albrecht J, Sprenger M, Müller L, Goth C, Franke J (2023)
Publication Type: Journal article
Publication year: 2023
Article Number: 115097
DOI: 10.1016/j.microrel.2023.115097
The demand for reliable, lead-free and high temperature stable solder interconnects for power electronic application has increased in recent years. The die attach solder materials are exposed to higher electrical currents and temperatures due to advancing designs and wide band-gap semiconductors. The diffusion soldering material Sn-Cu-Sn with its high post processing melting temperature is a promising option for high temperature die attach interconnects. The aim of this work is to predict potential failure mechanisms in the die attach of automotive power modules due to simulation based thermo-mechanical analysis of the diffusion solder Sn-Cu-Sn layer and SAC. The FE-model is validated with experimental results from active power cycling tests. The simulation indicates a potential for lifetime increase by usage of layered diffusion solder. The created FE-simulation model could be used for simulation-based design for reliability to reduce material costs and development time.
APA:
Ottinger, B., Mathew, A., König, S., Albrecht, J., Sprenger, M., Müller, L.,... Franke, J. (2023). Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation. Microelectronics Reliability. https://doi.org/10.1016/j.microrel.2023.115097
MLA:
Ottinger, Bettina, et al. "Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation." Microelectronics Reliability (2023).
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