Sprenger M, Kramer M, Tolyschew E, Steinau M, Renner D, Ottinger B, Franke J (2023)
Publication Type: Conference contribution
Publication year: 2023
Publisher: Institute of Electrical and Electronics Engineers Inc.
Conference Proceedings Title: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
ISBN: 9798350345971
DOI: 10.1109/EuroSimE56861.2023.10100795
Warpage behaviour of a transfer-molded power module package has been studied experimentally and numerically throughout the assembly flow. Warpage in different assembly states ((1) bare metal-ceramic substrates, (2) substrates attached to copper leadframe, (3) transfer-molded package) has been assessed and influences of variations of substrate backside structure and epoxy mold compound type onto the warpage evaluated. The numerical modeling framework build-up has been validated within this study and does allow for rapid warpage prediction based on package geometry and manufacturing process temperatures.
APA:
Sprenger, M., Kramer, M., Tolyschew, E., Steinau, M., Renner, D., Ottinger, B., & Franke, J. (2023). Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization. In 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Graz, AT: Institute of Electrical and Electronics Engineers Inc..
MLA:
Sprenger, Mario, et al. "Warpage of transfer-molded automotive power modules - experimental characterization, numerical simulation and optimization." Proceedings of the 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023, Graz Institute of Electrical and Electronics Engineers Inc., 2023.
BibTeX: Download