Study of a laser packaging technique simulated with ANSYS and virtuallab fusion software
Ribes-Pleguezuelo P, Zhang S, Beckert E, Eberhardt R, Wyrowski F, Tu¨nnermann A (2017)
Publication Type: Conference contribution
Publication year: 2017
Publisher: OSA - The Optical Society
Book Volume: Part F67-LIC 2017
Conference Proceedings Title: Optics InfoBase Conference Papers
Event location: Bucharest, ROU
ISBN: 9781557528209
Abstract
Mechanico-optical simulations performed with ANSYS and VirtualLab Fusion software to analyze stress-induced birefringence for the packaging of a laser ignition device by a low-stress soldering technique showed almost no influence on the laser output beam.
Involved external institutions
Fraunhofer-Institut für Angewandte Optik und Feinmechanik (IOF) / Fraunhofer Institute for Applied Optics and Precision Engineering
Germany (DE)
Friedrich-Schiller-Universität Jena
Germany (DE)
Germany (DE)
Friedrich-Schiller-Universität Jena
Germany (DE)
How to cite
APA:
Ribes-Pleguezuelo, P., Zhang, S., Beckert, E., Eberhardt, R., Wyrowski, F., & Tu¨nnermann, A. (2017). Study of a laser packaging technique simulated with ANSYS and virtuallab fusion software. In Optics InfoBase Conference Papers. Bucharest, ROU: OSA - The Optical Society.
MLA:
Ribes-Pleguezuelo, P., et al. "Study of a laser packaging technique simulated with ANSYS and virtuallab fusion software." Proceedings of the Laser Ignition Conference, LIC 2017, Bucharest, ROU OSA - The Optical Society, 2017.
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