Method to simulate and analyse induced stresses for laser crystal packaging technologies

Ribes-Pleguezuelo P, Zhang S, Beckert E, Eberhardt R, Wyrowski F, Tuennermann A (2017)

Publication Type: Journal article

Publication year: 2017

Journal

Optics Express Optical Society of America

Book Volume: 25

Pages Range: 5927-5940

Journal Issue: 6

DOI: 10.1364/OE.25.005927

Abstract

A method to simulate induced stresses for a laser crystal packaging technique and the consequent study of birefringent effects inside the laser cavities has been developed. The method has been implemented by thermo-mechanical simulations implemented with ANSYS 17.0. ANSYS results were later imported in VirtualLab Fusion software where input/output beams in terms of wavelengths and polarization were analysed. The study has been built in the context of a low-stress soldering technique implemented for glass or crystal optics packaging's called the solderjet bumping technique. The outcome of the analysis showed almost no difference between the input and output laser beams for the laser cavity constructed with an yttrium aluminum garnet active laser crystal, a second harmonic generator beta-barium borate, and the output laser mirror made of fused silica assembled by the low-stress solderjet bumping technique.

Involved external institutions

Fraunhofer-Institut für Angewandte Optik und Feinmechanik (IOF) / Fraunhofer Institute for Applied Optics and Precision Engineering DE Germany (DE) Friedrich-Schiller-Universität Jena DE Germany (DE)

How to cite

APA:

Ribes-Pleguezuelo, P., Zhang, S., Beckert, E., Eberhardt, R., Wyrowski, F., & Tuennermann, A. (2017). Method to simulate and analyse induced stresses for laser crystal packaging technologies. Optics Express, 25(6), 5927-5940. https://dx.doi.org/10.1364/OE.25.005927

MLA:

Ribes-Pleguezuelo, Pol, et al. "Method to simulate and analyse induced stresses for laser crystal packaging technologies." Optics Express 25.6 (2017): 5927-5940.

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