Low-stress soldering technique used to assemble an optical system for aerospace missions

Ribes-Pleguezuelo P, Koechlin C, Burkhardt T, Hornaff M, Kamm A, Gramens S, Beckert E, Fiault G, Eberhardt R, Tünnermann A (2017)

Publication Type: Conference contribution

Publication year: 2017

Journal

Proceedings of SPIE Society of Photo-optical Instrumentation Engineers (SPIE)

Publisher: SPIE

Book Volume: 10562

Conference Proceedings Title: Proceedings of SPIE - The International Society for Optical Engineering

Event location: Biarritz, FRA

ISBN: 9781510616134

DOI: 10.1117/12.2296074

Abstract

A high-precision opto-mechanical breadboard for a lens mount has been assembled by means of a laserbased soldering process called Solderjet Bumping; which thanks to its localized and minimized input of thermal energy, is well suited for the joining of optical components made of fragile and brittle materials such as glasses. An optical element made of a silica lens and a titanium barrel has been studied to replicate the lens mounts of the afocal beam expander used in the LIDAR instrument (ATLID) of the ESA EarthCare Mission, whose aim is to monitor molecular and particle-based back-scattering in order to analyze atmosphere composition. Finally, a beam expander optical element breadboard with a silica lens and a titanium barrel was assembled using the Solderjet Bumping technology with Sn96.5Ag3Cu0.5 SAC305 alloy resulting in a low residual stress (<1 MPa) on the joining areas, a low light-depolarization (<0.2 %) and low distortion (wave-front error measurement < 5 nm rms) on the assemblies. The devices also successfully passed humidity, thermal-vacuum, vibration, and shock tests with conditions similar to the ones expected for the ESA EarthCare mission and without altering their optical performances.

Involved external institutions

Fraunhofer-Institut für Angewandte Optik und Feinmechanik (IOF) / Fraunhofer Institute for Applied Optics and Precision Engineering DE Germany (DE) SODERN FR France (FR)

How to cite

APA:

Ribes-Pleguezuelo, P., Koechlin, C., Burkhardt, T., Hornaff, M., Kamm, A., Gramens, S.,... Tünnermann, A. (2017). Low-stress soldering technique used to assemble an optical system for aerospace missions. In Bruno Cugny, Nikos Karafolas, Zoran Sodnik (Eds.), Proceedings of SPIE - The International Society for Optical Engineering. Biarritz, FRA: SPIE.

MLA:

Ribes-Pleguezuelo, P., et al. "Low-stress soldering technique used to assemble an optical system for aerospace missions." Proceedings of the International Conference on Space Optics, ICSO 2016, Biarritz, FRA Ed. Bruno Cugny, Nikos Karafolas, Zoran Sodnik, SPIE, 2017.

BibTeX: Download