Solderjet bumping packaging technique optimization for the miniaturization of laser devices
Ribes-Pleguezuelo P, Septriani B, Zhang S, Beckert E, Eberhardt R, Wyrowski F, Tuennermann A (2017)
Publication Type: Journal article
Publication year: 2017
Journal
Book Volume: 13
Article Number: 34
Journal Issue: 1
DOI: 10.1186/s41476-017-0063-7
Abstract
Background: Low-stress soldering techniques can guarantee a minimized input of thermal energy allowing for the design and later assembly of more robust and miniaturized optical devices. However, in order to build miniaturized optical devices, these small-induced stresses produced by soldering techniques have to be investigated to guarantee that the stress-induced birefringence effects do not alter the device optical properties and requirements. Methods: An analytical method that relates the stress-induced birefringence of laser components with their corresponding lasing capabilities has been compared to the real induced-stress results created in components packaged using solderjet technology. The main goal was to optimize the optical component packaging by using this low induced-stress soldering technique. The optimization was carried out by assessing components miniaturization while still assuring high robustness of the bond strength without creating a beam depolarization ratio of more than 1%. Results: The outcome of the study showed the possibility of assembling laser optical components down to sizes of around 300 μm, creating a bond strength of 5 N and higher, and a depolarization ratio much lower than the proposed target of 1%. Conclusions: Our results in terms of induced stress agreed with the finite element method result, which would imply correct post-processing laser simulations. This suggested that the solderjet bumping technique could robustly join components down to the laser emission beam size without strongly affecting the optical properties.
Involved external institutions
Friedrich-Schiller-Universität Jena
Germany (DE)
Fraunhofer-Institut für Angewandte Optik und Feinmechanik (IOF) / Fraunhofer Institute for Applied Optics and Precision Engineering
Germany (DE)
Germany (DE)
Fraunhofer-Institut für Angewandte Optik und Feinmechanik (IOF) / Fraunhofer Institute for Applied Optics and Precision Engineering
Germany (DE)
How to cite
APA:
Ribes-Pleguezuelo, P., Septriani, B., Zhang, S., Beckert, E., Eberhardt, R., Wyrowski, F., & Tuennermann, A. (2017). Solderjet bumping packaging technique optimization for the miniaturization of laser devices. Journal of the European Optical Society: Rapid Publications, 13(1). https://dx.doi.org/10.1186/s41476-017-0063-7
MLA:
Ribes-Pleguezuelo, P., et al. "Solderjet bumping packaging technique optimization for the miniaturization of laser devices." Journal of the European Optical Society: Rapid Publications 13.1 (2017).
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