Ultrashort pulse laser processing of silica at high repetition rates—from network change to residual strain
Zimmermann F, Lancry M, Plech A, Richter S, Ullsperger T, Poumellec B, Tuennermann A, Nolte S (2017)
Publication Type: Journal article
Publication year: 2017
Journal
Book Volume: 8
Pages Range: 233-238
Journal Issue: 2
DOI: 10.1111/ijag.12221
Abstract
We report on the analysis of silica-based glasses after processing with ultrashort laser pulses at high repetition rates. Heat accumulation leads to strong local heating of the glass. The subsequent quenching results in a fictive temperature rise that scales with the repetition rate. Consequently, the relative volume change leads to residual tensile strain within the modified volume of larger than 10−3, which is confirmed by wide-angle X-ray scattering (WAXS) measurements. Studying the surface topography after cleaving of laser-modified regions allows for quantification of the corresponding elastic strain as well as the glass density behavior on the fictive temperature.
Involved external institutions
Friedrich-Schiller-Universität Jena
Germany (DE)
École Polytechnique - Université Paris-Saclay
France (FR)
Karlsruhe Institute of Technology (KIT)
Germany (DE)
TRUMPF Laser- und Systemtechnik GmbH
Germany (DE)
Germany (DE)
École Polytechnique - Université Paris-Saclay
France (FR)
Karlsruhe Institute of Technology (KIT)
Germany (DE)
TRUMPF Laser- und Systemtechnik GmbH
Germany (DE)
How to cite
APA:
Zimmermann, F., Lancry, M., Plech, A., Richter, S., Ullsperger, T., Poumellec, B.,... Nolte, S. (2017). Ultrashort pulse laser processing of silica at high repetition rates—from network change to residual strain. International Journal of Applied Glass Science, 8(2), 233-238. https://doi.org/10.1111/ijag.12221
MLA:
Zimmermann, Felix, et al. "Ultrashort pulse laser processing of silica at high repetition rates—from network change to residual strain." International Journal of Applied Glass Science 8.2 (2017): 233-238.
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