Bond strength and stability of solderjet bumping packaging technique for laser device miniaturization
Septriani B, Pleguezuelo PR, Beckert E, Eberhardt R, Tünnermann A (2018)
Publication Type: Conference contribution
Publication year: 2018
Publisher: Mesago Messe Frankfurt GmbH
Pages Range: 504-507
Conference Proceedings Title: Smart Systems Integration 2018 - International Conference and Exhibition on Integration Issues of Miniaturized Systems
Event location: Dresden, DEU
ISBN: 9783957350824
Involved external institutions
Friedrich-Schiller-Universität Jena
Germany (DE)
Fraunhofer-Institut für Angewandte Optik und Feinmechanik (IOF) / Fraunhofer Institute for Applied Optics and Precision Engineering
Germany (DE)
Germany (DE)
Fraunhofer-Institut für Angewandte Optik und Feinmechanik (IOF) / Fraunhofer Institute for Applied Optics and Precision Engineering
Germany (DE)
How to cite
APA:
Septriani, B., Pleguezuelo, P.R., Beckert, E., Eberhardt, R., & Tünnermann, A. (2018). Bond strength and stability of solderjet bumping packaging technique for laser device miniaturization. In Thomas Otto (Eds.), Smart Systems Integration 2018 - International Conference and Exhibition on Integration Issues of Miniaturized Systems (pp. 504-507). Dresden, DEU: Mesago Messe Frankfurt GmbH.
MLA:
Septriani, Brigitta, et al. "Bond strength and stability of solderjet bumping packaging technique for laser device miniaturization." Proceedings of the Smart Systems Integration 2018 - 12th International Conference and Exhibition on Integration Issues of Miniaturized Systems, Dresden, DEU Ed. Thomas Otto, Mesago Messe Frankfurt GmbH, 2018. 504-507.
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