Additive manufacturing of pure copper using ultrashort laser pulses
Kaden L, Matthaeus G, Ramm R, Ullsperger T, Seyfarth B, Nolte S (2019)
Publication Type: Conference contribution
Publication year: 2019
Journal
Publisher: SPIE
Book Volume: 10909
Conference Proceedings Title: Proceedings of SPIE - The International Society for Optical Engineering
Event location: San Francisco, CA, USA
ISBN: 9781510624603
DOI: 10.1117/12.2507401
Abstract
Here we present laser aided additive manufacturing of pure copper parts using ultrashort laser pulses. The process is based on the powder bed fusion of pure copper powder with grain sizes in the range of 5 μm - 15 μm. For processing, a fiber laser system delivering 500 fs pulses at a wavelengths of 515 nm was used. Robust 3D printed parts are generated featuring a high degree of resolution. The fabricated copper samples were characterized in terms of morphology, density distribution, thermal and electrical conductivity. The inner structure is revealed by x-ray computed tomography measurements.
Involved external institutions
Friedrich-Schiller-Universität Jena
Germany (DE)
Fraunhofer-Institut für Angewandte Optik und Feinmechanik (IOF) / Fraunhofer Institute for Applied Optics and Precision Engineering
Germany (DE)
Germany (DE)
Fraunhofer-Institut für Angewandte Optik und Feinmechanik (IOF) / Fraunhofer Institute for Applied Optics and Precision Engineering
Germany (DE)
How to cite
APA:
Kaden, L., Matthaeus, G., Ramm, R., Ullsperger, T., Seyfarth, B., & Nolte, S. (2019). Additive manufacturing of pure copper using ultrashort laser pulses. In Bo Gu, Henry Helvajian, Hongqiang Chen (Eds.), Proceedings of SPIE - The International Society for Optical Engineering. San Francisco, CA, USA: SPIE.
MLA:
Kaden, Lisa, et al. "Additive manufacturing of pure copper using ultrashort laser pulses." Proceedings of the Laser 3D Manufacturing VI 2019, San Francisco, CA, USA Ed. Bo Gu, Henry Helvajian, Hongqiang Chen, SPIE, 2019.
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