Beam shaping with higher laguerre-Gaussian orders for high power bessel beams

Siems MP, Thomas JU, Vetter C, Bergner K, Gross H, Nolte S (2019)


Publication Type: Conference contribution

Publication year: 2019

Publisher: Institute of Electrical and Electronics Engineers Inc.

Conference Proceedings Title: 2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019

Event location: Munich, DEU

ISBN: 9781728104690

DOI: 10.1109/CLEOE-EQEC.2019.8873095

Abstract

Ultra short pulse lasers offer unique possibilities in material processing applications. The extremely high intensities in the focus of a femtosecond or picosecond laser pulse cause non-linear absorption inside an otherwise transparent material. This leads to a highly localized deposition of energy and can be used to create tailored modifications inside the bulk of the material without damaging the surface [1]. The induced structures can for example be arranged as a breaking layer for cleaving glass. Tailored beam-shaping techniques can significantly improve this process. Using Bessel-Gaussian focal lines create long and thin modifications which dramatically improve the breaking process and quality of the resulting edge surface [2]. To create the Bessel-Gaussian beams an axicon, as shown in Fig. 1, is typically used in high power applications due to its high damage threshold.

Involved external institutions

How to cite

APA:

Siems, M.P., Thomas, J.U., Vetter, C., Bergner, K., Gross, H., & Nolte, S. (2019). Beam shaping with higher laguerre-Gaussian orders for high power bessel beams. In 2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019. Munich, DEU: Institute of Electrical and Electronics Engineers Inc..

MLA:

Siems, Malte Per, et al. "Beam shaping with higher laguerre-Gaussian orders for high power bessel beams." Proceedings of the 2019 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2019, Munich, DEU Institute of Electrical and Electronics Engineers Inc., 2019.

BibTeX: Download