Chambonneau M, Li Q, Fedorov VY, Blothe M, Tzortzakis S, Nolte S (2021)
Publication Type: Conference contribution
Publication year: 2021
Publisher: SPIE
Book Volume: 11676
Conference Proceedings Title: Proceedings of SPIE - The International Society for Optical Engineering
Event location: Virtual, Online, USA
ISBN: 9781510641877
DOI: 10.1117/12.2579220
Ultrafast laser welding is a fast, clean, and contactless technique for joining a broad range of materials. Nevertheless, this technique cannot be applied for bonding semiconductors and metals. By investigating the nonlinear propagation of picosecond laser pulses in silicon, it is elucidated how the evolution of filaments during propagation prevents the energy deposition at the semiconductor-metal interface. While the restrictions imposed by nonlinear propagation effects in semiconductors usually inhibit countless applications, the possibility to perform semiconductor-metal ultrafast laser welding is demonstrated. This technique relies on the determination and the precompensation of the nonlinear focal shift for relocating filaments and thus optimizing the energy deposition at the interface between the materials. The resulting welds show remarkable shear joining strengths (up to 2.2 MPa) compatible with applications in microelectronics. Material analyses shed light on the physical mechanisms involved during the interaction.
APA:
Chambonneau, M., Li, Q., Fedorov, V.Y., Blothe, M., Tzortzakis, S., & Nolte, S. (2021). Semiconductor-metal ultrafast laser welding with relocated filaments. In Peter R. Herman, Michel Meunier, Roberto Osellame (Eds.), Proceedings of SPIE - The International Society for Optical Engineering. Virtual, Online, USA: SPIE.
MLA:
Chambonneau, Maxime, et al. "Semiconductor-metal ultrafast laser welding with relocated filaments." Proceedings of the Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XXI 2021, Virtual, Online, USA Ed. Peter R. Herman, Michel Meunier, Roberto Osellame, SPIE, 2021.
BibTeX: Download