Mastering micro-filamentation for semiconductor-metal ultrafast laser welding

Chambonneau M, Li Q, Fedorov VY, Blothe M, Tzortzakis S, Nolte S (2021)

Publication Type: Conference contribution

Publication year: 2021

Publisher: Institute of Electrical and Electronics Engineers Inc.

Conference Proceedings Title: 2021 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2021

Event location: Munich, DEU

ISBN: 9781665418768

DOI: 10.1109/CLEO/Europe-EQEC52157.2021.9541622

Abstract

Ultrafast laser welding is a proven technique which enables to bond a wide variety of materials together. This technique relies on laser energy deposition at the interface between two materials. While, to date, ultrafast laser welding has been demonstrated in numerous material configurations such as glass-glass, glass-semiconductor, glass-metal, polymer-polymer, and ceramic-ceramic, it has no equivalent for the semiconductor-metal configuration so far, which would be particularly interesting for applications in microelectronics.

Involved external institutions

Friedrich-Schiller-Universität Jena DE Germany (DE) Texas A&M University at Qatar (TAMUQ) / جامعة تكساس أي اند إم QA Qatar (QA)

How to cite

APA:

Chambonneau, M., Li, Q., Fedorov, V.Y., Blothe, M., Tzortzakis, S., & Nolte, S. (2021). Mastering micro-filamentation for semiconductor-metal ultrafast laser welding. In 2021 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2021. Munich, DEU: Institute of Electrical and Electronics Engineers Inc..

MLA:

Chambonneau, Maxime, et al. "Mastering micro-filamentation for semiconductor-metal ultrafast laser welding." Proceedings of the 2021 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2021, Munich, DEU Institute of Electrical and Electronics Engineers Inc., 2021.

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