In-plane modulus of singular 2:1 clay lamellae applying a simple wrinkling technique

Kunz DA, Erath J, Kluge D, Thurn H, Putz B, Fery A, Breu J (2013)

Publication Type: Journal article

Publication year: 2013

Journal

ACS Applied Materials and Interfaces American Chemical Society

Book Volume: 5

Pages Range: 5851-5855

Journal Issue: 12

DOI: 10.1021/am4015204

Abstract

Knowledge of the mechanical properties of singular clay lamellae is of crucial importance for the optimization of clay-polymer nanocomposites. On the basis of controlled stress release, singular 2:1 clay lamellae show regular wrinkles on a deformable substrate. A subsequent two-dimensional Fourier transformation gives an in-plane modulus of the clay lamella of approximately 150 GPa. Only readily-available topographical atomic force microscopy is required for analysis rendering that fast and facile procedure generally applicable for nanoplatelet characterization. © 2013 American Chemical Society.

Involved external institutions

Universität Bayreuth DE Germany (DE)

How to cite

APA:

Kunz, D.A., Erath, J., Kluge, D., Thurn, H., Putz, B., Fery, A., & Breu, J. (2013). In-plane modulus of singular 2:1 clay lamellae applying a simple wrinkling technique. ACS Applied Materials and Interfaces, 5(12), 5851-5855. https://doi.org/10.1021/am4015204

MLA:

Kunz, Daniel A., et al. "In-plane modulus of singular 2:1 clay lamellae applying a simple wrinkling technique." ACS Applied Materials and Interfaces 5.12 (2013): 5851-5855.

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