Low-temperature photosensitive polyimide processing for use in 3D integration technologies

Windrich F, Malanin M, Eichhorn KJ, Voit B, Lang KD (2014)

Publication Type: Conference contribution

Publication year: 2014

Journal

Materials Research Society Symposium - Proceedings Materials Research Society

Publisher: Materials Research Society

Book Volume: 1692

Conference Proceedings Title: Materials Research Society Symposium Proceedings

Event location: San Francisco, CA, USA

DOI: 10.1557/opl.2014.520

Abstract

Imidization in solid state and the impact of photo-crosslinking of a photosensitive low-temperature cure ester-type polyimide was studied by in-situ FT-IR spectroscopy. Imidization kinetics depends on the crosslinking degree of the PI precursor. It is confirmed that the full imidization can be achieved at T < 250°C with low exposure doses. The reaction rate within the chemically-controlled region is lowered with increased exposure energy from 0.279 min-1 to 0.097 min-1 and to 0.038 min-1 at 215°C. The diffusion controlled rate constant at 215°C is lowered from 0.00329 min-1 to 0.00298min-1 and to 0.00170min-1 with increased exposure energy 0, 200, 600mJ/cm2 respectively. This shows that crosslinking has a major influence on the chemically-controlled reaction rate. Thermo gravimetric analysis (TGA) and TGA/FT-IR spectroscopy confirms the in-situ FT-IR results. At temperatures > 300°C further weight losses of volatile components were detected.

Involved external institutions

Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM DE Germany (DE) Leibniz-Institut für Polymerforschung Dresden e. V. DE Germany (DE)

How to cite

APA:

Windrich, F., Malanin, M., Eichhorn, K.J., Voit, B., & Lang, K.D. (2014). Low-temperature photosensitive polyimide processing for use in 3D integration technologies. In S. Barry (Eds.), Materials Research Society Symposium Proceedings. San Francisco, CA, USA: Materials Research Society.

MLA:

Windrich, Frank, et al. "Low-temperature photosensitive polyimide processing for use in 3D integration technologies." Proceedings of the 2014 MRS Spring Meeting, San Francisco, CA, USA Ed. S. Barry, Materials Research Society, 2014.

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