Fabrication of a micro-thermoelectric cooler for room temperature applications by template assisted electrodeposition
García J, Pérez N, Mohn M, Sieger T, Schlörb H, Reith H, Schierning G, Nielsch K (2016)
Publication Type: Conference contribution
Publication year: 2016
Publisher: Institute of Electrical and Electronics Engineers Inc.
Pages Range: 14-18
Conference Proceedings Title: THERMINIC 2016 - 22nd International Workshop on Thermal Investigations of ICs and Systems
Event location: Budapest, HUN
ISBN: 9781509054503
DOI: 10.1109/THERMINIC.2016.7748640
Abstract
Solid state refrigeration is of great interest due to its potential application in electronic and optoelectronic systems. Nowadays, macroscopic thermoelectric coolers are part of such systems and their cooling performance and reliability are well proven. However, the feasibility of microstructuring such kind of devices by means of photolithographic techniques, opens the possibility of integration on a chip for better local thermal management. Together with previous facts, electrodeposition processes are well known to be low cost, highly scalable and compatible with lithographic techniques. In this work we report on the fabrication of BiTe-based Micro-Thermoelectric Coolers by means of a mixed process flow involving photolithography and electrodeposition techniques. Materials and geometry of the device have been chosen to optimise the cooling performance on an integrated photonic system.
Involved external institutions
Germany (DE)How to cite
APA:
García, J., Pérez, N., Mohn, M., Sieger, T., Schlörb, H., Reith, H.,... Nielsch, K. (2016). Fabrication of a micro-thermoelectric cooler for room temperature applications by template assisted electrodeposition. In Andras Poppe (Eds.), THERMINIC 2016 - 22nd International Workshop on Thermal Investigations of ICs and Systems (pp. 14-18). Budapest, HUN: Institute of Electrical and Electronics Engineers Inc..
MLA:
García, J., et al. "Fabrication of a micro-thermoelectric cooler for room temperature applications by template assisted electrodeposition." Proceedings of the 22nd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2016, Budapest, HUN Ed. Andras Poppe, Institute of Electrical and Electronics Engineers Inc., 2016. 14-18.
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