Large-scale direct SLAM for omnidirectional cameras

Caruso D, Engel J, Cremers D (2015)


Publication Type: Conference contribution

Publication year: 2015

Journal

Publisher: Institute of Electrical and Electronics Engineers Inc.

Book Volume: 2015-December

Pages Range: 141-148

Conference Proceedings Title: IEEE International Conference on Intelligent Robots and Systems

Event location: Hamburg, DEU

ISBN: 9781479999941

DOI: 10.1109/IROS.2015.7353366

Abstract

We propose a real-time, direct monocular SLAM method for omnidirectional or wide field-of-view fisheye cameras. Both tracking (direct image alignment) and mapping (pixel-wise distance filtering) are directly formulated for the unified omnidirectional model, which can model central imaging devices with a field of view above 180 °. This is in contrast to existing direct mono-SLAM approaches like DTAM or LSD-SLAM, which operate on rectified images, in practice limiting the field of view to around 130 ° diagonally. Not only does this allows to observe - and reconstruct - a larger portion of the surrounding environment, but it also makes the system more robust to degenerate (rotation-only) movement. The two main contribution are (1) the formulation of direct image alignment for the unified omnidirectional model, and (2) a fast yet accurate approach to incremental stereo directly on distorted images. We evaluated our framework on real-world sequences taken with a 185 ° fisheye lens, and compare it to a rectified and a piecewise rectified approach.

Involved external institutions

How to cite

APA:

Caruso, D., Engel, J., & Cremers, D. (2015). Large-scale direct SLAM for omnidirectional cameras. In IEEE International Conference on Intelligent Robots and Systems (pp. 141-148). Hamburg, DEU: Institute of Electrical and Electronics Engineers Inc..

MLA:

Caruso, David, Jakob Engel, and Daniel Cremers. "Large-scale direct SLAM for omnidirectional cameras." Proceedings of the IEEE/RSJ International Conference on Intelligent Robots and Systems, IROS 2015, Hamburg, DEU Institute of Electrical and Electronics Engineers Inc., 2015. 141-148.

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