Kordaß T, Franke J (2014)
Publication Type: Conference contribution
Publication year: 2014
Publisher: Institute of Electrical and Electronics Engineers Inc.
Pages Range: 491-495
Conference Proceedings Title: Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, ISSE 2014
Event location: Dresden, DEU
ISBN: 9781479944552
DOI: 10.1109/ISSE.2014.6887650
This paper gives an overview about the advantage of galvanic plating for 3D-MIDs. At first it is explained how the laser direct structuring process is proceeded. Exemplary on a serial application for motorcycles it shows the challenges for the chemical standard plating in the serial processes in the first part. The second part illustrates the differences in the plating processes between the galvanic and the chemical precipitation. The advantages with major coating thickness for further developed applications are mentioned. It is also given the particular specifics need to be considered in the development for the galvanic process.
APA:
Kordaß, T., & Franke, J. (2014). Galvanic plating for 3D-MID applications. In Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, ISSE 2014 (pp. 491-495). Dresden, DEU: Institute of Electrical and Electronics Engineers Inc..
MLA:
Kordaß, Timo, and Jörg Franke. "Galvanic plating for 3D-MID applications." Proceedings of the 2014 37th International Spring Seminar on Electronics Technology, ISSE 2014, Dresden, DEU Institute of Electrical and Electronics Engineers Inc., 2014. 491-495.
BibTeX: Download