Laser Microspot Welding in Electronics Production
Mys I, Schmidt M (2017)
Publication Type: Authored book
Publication year: 2017
Publisher: Elsevier
ISBN: 9780081012529
DOI: 10.1016/B978-0-08-101252-9.00008-X
Abstract
Al has more significance in electrical and electronic applications like solar energy collectors or light-weight electric motors and actuators. It combines comparably good thermal and electrical properties with an attractive price and low material weight. However, the main difficulty for a widespread use of Al is the lack of a reliable joining process to connect it with Cu. The problems during welding of Cu and Al are caused by a large misalignment in physical properties and even more, a poor metallurgical affinity of both materials and therefore high crack sensitivity and formation of brittle intermetallic phases during fusion welding. In this chapter we introduce current results on laser microspot welding of Cu and Al with the objective to improve the mechanical properties of welded joints. The experiments are carried out on two main welding assemblies—overlap joint with side face weld and overlap joint with fillet weld. Weld microstructure and weld quality are affected by two strategies. First, a weight proportion of Cu and Al in weld microstructure is adjusted and controlled by laser beam incidence position/beam offset and beam incidence angle (for fillet weld). Second, an alloying effect of small amounts of Ag, Ni, and Sn filler materials on ductility of weld microstructure has been investigated. The reliability of welded joints is verified by means of dynamic fatigue tests, heat aging at different temperature profiles, and chemical aging with some selected chemical agents.
Involved external institutions
Germany (DE)How to cite
APA:
Mys, I., & Schmidt, M. (2017). Laser Microspot Welding in Electronics Production. Elsevier.
MLA:
Mys, I., and M. Schmidt. Laser Microspot Welding in Electronics Production. Elsevier, 2017.
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