Effects of Fumed Silica on Thixotropic Behavior and Processing Window by UV-Assisted Direct Ink Writing

Jiang F, Zhou M, Drummer D (2022)


Publication Type: Journal article

Publication year: 2022

Journal

Book Volume: 14

Journal Issue: 15

DOI: 10.3390/polym14153107

Abstract

In this research, the effects of fumed silica (FS) on the Ultraviolet (UV)-ink rheological behavior and processing windows were discussed. Objects using different concentrations of FS inks were printed by the modified UV-Direct ink writing (DIW) printer. The function of fumed silica in the ink-based system has been verified, and the processing scope has been expended with a suitable amount of FS combined with the UV light. The results show that the combination of a suitable amount of FS with the UV-DIW system reaches fast and accurate printing with a larger processing window compared to the non-UV system. However, an excessively high concentration of FS will increase the yield stress of the ink, which also increases the requirement of extrusion unit and the die-swelling effects.

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APA:

Jiang, F., Zhou, M., & Drummer, D. (2022). Effects of Fumed Silica on Thixotropic Behavior and Processing Window by UV-Assisted Direct Ink Writing. Polymers, 14(15). https://doi.org/10.3390/polym14153107

MLA:

Jiang, Fengze, Mingyong Zhou, and Dietmar Drummer. "Effects of Fumed Silica on Thixotropic Behavior and Processing Window by UV-Assisted Direct Ink Writing." Polymers 14.15 (2022).

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