Schmidt R, Kaesbauer M, Sippel M, Dreher P (2020)
Publication Language: English
Publication Type: Conference contribution
Publication year: 2020
Publisher: VDE Verlag GmbH
City/Town: Berlin and Offenbach
Pages Range: 196--201
Conference Proceedings Title: Proceedings of the 11th International Conference on Integrated Power Electronics Systems (CIPS 2020)
ISBN: 978-3-8007-5225-6
APA:
Schmidt, R., Kaesbauer, M., Sippel, M., & Dreher, P. (2020). Power Cycle Testing at Low Temperature Swings – Evaluating the Stability of SAC- and SnSb-based Chip Solder Layers. In Proceedings of the 11th International Conference on Integrated Power Electronics Systems (CIPS 2020) (pp. 196--201). Berlin and Offenbach: VDE Verlag GmbH.
MLA:
Schmidt, Ralf, et al. "Power Cycle Testing at Low Temperature Swings – Evaluating the Stability of SAC- and SnSb-based Chip Solder Layers." Proceedings of the 11th International Conference on Integrated Power Electronics Systems (CIPS 2020) Berlin and Offenbach: VDE Verlag GmbH, 2020. 196--201.
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