Seefried J, Mahr A, Weigelt M, Kühl A, Franke J (2021)
Publication Type: Conference contribution
Publication year: 2021
Publisher: IEEE
City/Town: NEW YORK
Pages Range: 198-205
Conference Proceedings Title: 2021 11TH INTERNATIONAL ELECTRIC DRIVES PRODUCTION CONFERENCE (EDPC)
Event location: , ELECTR NETWORK
DOI: 10.1109/EDPC53547.2021.9684202
APA:
Seefried, J., Mahr, A., Weigelt, M., Kühl, A., & Franke, J. (2021). Challenges of Contacting Processes for Thin Copper Flat Wires in the Context of Electromechanical Engineering. In 2021 11TH INTERNATIONAL ELECTRIC DRIVES PRODUCTION CONFERENCE (EDPC) (pp. 198-205). , ELECTR NETWORK: NEW YORK: IEEE.
MLA:
Seefried, Johannes, et al. "Challenges of Contacting Processes for Thin Copper Flat Wires in the Context of Electromechanical Engineering." Proceedings of the 11th International Electric Drives Production Conference (E/DPC), , ELECTR NETWORK NEW YORK: IEEE, 2021. 198-205.
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