In-situ characterization of thin polyimide films used for microelectronic packaging

Windrich F, Malanin M, Bittrich E, Schwarz A, Eichhorn KJ, Voit B (2018)

Publication Type: Conference contribution

Publication year: 2018

Publisher: Institute of Electrical and Electronics Engineers Inc.

Conference Proceedings Title: 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings

Event location: Dresden, DEU

ISBN: 9781538668139

DOI: 10.1109/ESTC.2018.8546416

Abstract

Different in-situ methods were utilized to study thin film polyimide layers in the context of low-temperature cure processes <230°. In-situ Fourier Transform Infrared Spectroscopy, temperature dependent Spectroscopic Ellipsometry and Thermal Analytical Methods were used to characterize the degree of imidization, glass transition temperature and thermal stability respectively. The final degree of imidization in the low-temperature cure region depends strongly on the UV induced network formation during the upstream Iithographic process. A higher crosslinking density reduces the degree of imidization from 97.5% for an unexposed layer to 73.2% for higher crosslinked film. Glass transition temperature and thermal stability are significantly reduced in the case of curing temperatures below 230°C. The glass transition temperature is decreased from 240°C to 218°C for cure temperatures of 350°C and 230°C respectively. The yielded film stress is reduced in parallel, which was proved by determination of wafer warpage and bow.

Involved external institutions

Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM DE Germany (DE) Leibniz-Institut für Polymerforschung Dresden e. V. DE Germany (DE)

How to cite

APA:

Windrich, F., Malanin, M., Bittrich, E., Schwarz, A., Eichhorn, K.J., & Voit, B. (2018). In-situ characterization of thin polyimide films used for microelectronic packaging. In 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Dresden, DEU: Institute of Electrical and Electronics Engineers Inc..

MLA:

Windrich, Frank, et al. "In-situ characterization of thin polyimide films used for microelectronic packaging." Proceedings of the 7th Electronic System-Integration Technology Conference, ESTC 2018, Dresden, DEU Institute of Electrical and Electronics Engineers Inc., 2018.

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