Integrated microthermoelectric coolers with rapid response time and high device reliability
Li G, Fernandez JG, Lara Ramos DA, Barati V, Perez N, Soldatov I, Reith H, Schierning G, Nielsch K (2018)
Publication Type: Journal article
Publication year: 2018
Journal
Book Volume: 1
Pages Range: 555-561
Journal Issue: 10
DOI: 10.1038/s41928-018-0148-3
Abstract
Microthermoelectric modules are of potential use in fields such as energy harvesting, thermal management, thermal imaging and high-spatial-resolution temperature sensing. In particular, microthermoelectric coolers (µ-TECs)—in which the application of an electric current cools the device—can be used to manage heat locally in microelectronic circuits. However, a cost-effective µ-TEC device that is compatible with the modern semiconductor fabrication industry has not yet been developed. Furthermore, the device performance of µ-TECs in terms of transient responses, cycling reliability and cooling stability has not been adequately assessed. Here we report the fabrication of µ-TECs that offer a rapid response time of 1 ms, reliability of up to 10 million cycles and a cooling stability of more than 1 month at constant electric current. The high cooling reliability and stability of our µ-TEC module can be attributed to a design of free-standing top contacts between the thermoelectric legs and metallic bridges, which reduces the thermomechanical stress in the devices.
Involved external institutions
Germany (DE)How to cite
APA:
Li, G., Fernandez, J.G., Lara Ramos, D.A., Barati, V., Perez, N., Soldatov, I.,... Nielsch, K. (2018). Integrated microthermoelectric coolers with rapid response time and high device reliability. Nature Electronics, 1(10), 555-561. https://doi.org/10.1038/s41928-018-0148-3
MLA:
Li, Guodong, et al. "Integrated microthermoelectric coolers with rapid response time and high device reliability." Nature Electronics 1.10 (2018): 555-561.
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