Thermally integrated smart photonics systems
Murchú CO, Shen A, Enright R, Nielsch K, Bachelet R, Leinse A, Charlet G, Punch J, O'Riordan C, Razeeb KM (2017)
Publication Type: Conference contribution
Publication year: 2017
Publisher: Mesago Messe Frankfurt GmbH
Pages Range: 436-438
Conference Proceedings Title: International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017
Event location: Cork, IRL
ISBN: 9783957350572
Involved external institutions
Nokia Corporation
Finland (FI)
Tyndall National Institute / Tyndall Institiúid Naisiunta
Ireland (IE)
III-V Lab
France (FR)
National Center for Scientific Research / Centre national de la recherche scientifique (CNRS)
France (FR)
LioniX International
Netherlands (NL)
Communicraft
Ireland (IE)
Leibniz-Institut für Festkörper- und Werkstoffforschung Dresden e.V. (IFW) / Leibniz Institute for Solid State and Materials Research Dresden
Germany (DE)
Finland (FI)
Tyndall National Institute / Tyndall Institiúid Naisiunta
Ireland (IE)
III-V Lab
France (FR)
National Center for Scientific Research / Centre national de la recherche scientifique (CNRS)
France (FR)
LioniX International
Netherlands (NL)
Communicraft
Ireland (IE)
Leibniz-Institut für Festkörper- und Werkstoffforschung Dresden e.V. (IFW) / Leibniz Institute for Solid State and Materials Research Dresden
Germany (DE)
How to cite
APA:
Murchú, C.O., Shen, A., Enright, R., Nielsch, K., Bachelet, R., Leinse, A.,... Razeeb, K.M. (2017). Thermally integrated smart photonics systems. In Thomas Otto (Eds.), International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017 (pp. 436-438). Cork, IRL: Mesago Messe Frankfurt GmbH.
MLA:
Murchú, Cian O., et al. "Thermally integrated smart photonics systems." Proceedings of the International Conference and Exhibition on Integration Issues of Miniaturized Systems 2017, SSI 2017, Cork, IRL Ed. Thomas Otto, Mesago Messe Frankfurt GmbH, 2017. 436-438.
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