Wafer container monitoring concerning airborne molecular contaminations along a 300 mm power semiconductor production flow
Franze P, Schneider G, Kaskel S (2021)
Publication Type: Conference contribution
Publication year: 2021
Journal
Publisher: Trans Tech Publications Ltd
Book Volume: 314 SSP
Pages Range: 41-46
Conference Proceedings Title: Solid State Phenomena
Event location: Mechelen, BEL
ISBN: 9783035738018
DOI: 10.4028/www.scientific.net/SSP.314.41
Abstract
The focus of the study was to understand the behavior of airborne molecular contaminations (AMC) within the 300 mm wafer containers called front-opening unified pods (FOUPs) in a high-volume fabrication facility for power semiconductors of Infineon Technologies Dresden. A main goal was to implement new concepts and strategies to prevent the different power semiconductors from any yield losses driven by AMC. It could be shown, that there is a strong dependency of the concentration and the type of the determined contaminations on the investigated process steps.
Involved external institutions
Germany (DE)How to cite
APA:
Franze, P., Schneider, G., & Kaskel, S. (2021). Wafer container monitoring concerning airborne molecular contaminations along a 300 mm power semiconductor production flow. In Paul W. Mertens, Kurt Wostyn, Marc Meuris, Marc Heyns (Eds.), Solid State Phenomena (pp. 41-46). Mechelen, BEL: Trans Tech Publications Ltd.
MLA:
Franze, Peter, Germar Schneider, and Stefan Kaskel. "Wafer container monitoring concerning airborne molecular contaminations along a 300 mm power semiconductor production flow." Proceedings of the 15th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2021, Mechelen, BEL Ed. Paul W. Mertens, Kurt Wostyn, Marc Meuris, Marc Heyns, Trans Tech Publications Ltd, 2021. 41-46.
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