Seidel R, Sippel M, Franke J (2021)
Publication Type: Conference contribution
Publication year: 2021
Publisher: IEEE COMPUTER SOC
City/Town: LOS ALAMITOS
Pages Range: 1427-1434
Conference Proceedings Title: IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)
Event location: , ELECTR NETWORK
DOI: 10.1109/ECTC32696.2021.00228
APA:
Seidel, R., Sippel, M., & Franke, J. (2021). An Analytical Approach to Thermal Design for Manufacturing in Mini Wave Soldering. In IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021) (pp. 1427-1434). , ELECTR NETWORK: LOS ALAMITOS: IEEE COMPUTER SOC.
MLA:
Seidel, Reinhardt, Marcel Sippel, and Jörg Franke. "An Analytical Approach to Thermal Design for Manufacturing in Mini Wave Soldering." Proceedings of the IEEE 71st Electronic Components and Technology Conference (ECTC), , ELECTR NETWORK LOS ALAMITOS: IEEE COMPUTER SOC, 2021. 1427-1434.
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