A new device to measure load and motion in lower limb prosthesis - Tested on different prosthetic feet

Schuy J, Burkl A, Rinderknecht S, Beckerle P (2014)

Publication Type: Conference contribution

Publication year: 2014

Publisher: Institute of Electrical and Electronics Engineers Inc.

Pages Range: 187-192

Conference Proceedings Title: 2014 IEEE International Conference on Robotics and Biomimetics, IEEE ROBIO 2014

Event location: Bali ID

ISBN: 9781479973965

DOI: 10.1109/ROBIO.2014.7090328

Abstract

In this work, a new system is presented to measure load and motion in six degrees of freedom synchronously to assess amputee gait in real time. The device is integrated in the shank of lower limb prostheses to measure the gait parameters based on a combination of AHRS (Attitude Heading Reference System) and a strain gauge pylon. This novel mobile and autonomous system enables new possibilities of amputee gait assessment by gathering both kinds of data. After a presentation of the system, two approaches to calculate the 6×6 calibration matrix of the strain gauge pylon with respect to main channels and cross talk channels are presented and compared. Finally, the data analysis process, a performed pilot study of a transfemoral amputee wearing two different prosthetic feet and consequent load results are discussed.

Authors with CRIS profile

Philipp Beckerle

Involved external institutions

Technische Universität Darmstadt DE Germany (DE)

How to cite

APA:

Schuy, J., Burkl, A., Rinderknecht, S., & Beckerle, P. (2014). A new device to measure load and motion in lower limb prosthesis - Tested on different prosthetic feet. In 2014 IEEE International Conference on Robotics and Biomimetics, IEEE ROBIO 2014 (pp. 187-192). Bali, ID: Institute of Electrical and Electronics Engineers Inc..

MLA:

Schuy, J., et al. "A new device to measure load and motion in lower limb prosthesis - Tested on different prosthetic feet." Proceedings of the 2014 IEEE International Conference on Robotics and Biomimetics, IEEE ROBIO 2014, Bali Institute of Electrical and Electronics Engineers Inc., 2014. 187-192.

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