Elogail Y, Fischer IA, Wendav T, Schulze J (2018)
Publication Type: Journal article
Publication year: 2018
Book Volume: 33
Article Number: 114001
Journal Issue: 11
High mobility materials are being studied to replace Si with the aim of enhancing the performance of nanoelectronic devices. Ge and III-V channels have recently received a lot of attention, where the combination of III-V channels in n-MOSFETs and Ge channels in p-MOSFETs integrated on Si substrates is regarded as a promising CMOS design. Ge integrated on Si is a very promising choice due to its superior transport properties and compatibility to CMOS technology. The main challenges faced by Ge-based FETs are the channel/gate interface quality, crystal defects due to integration on Si and the smaller bandgap compared to Si, which leads to elevated band-to-band-tunnelling leakage currents, setting limitations on the achievable off state current (I
APA:
Elogail, Y., Fischer, I.A., Wendav, T., & Schulze, J. (2018). Enhancement of Ge-based p-channel vertical FET performance by channel engineering using planar doping and a Ge/Si x Ge1-x-ySn y heterostructure model for low power FET applications. Semiconductor Science and Technology, 33(11). https://doi.org/10.1088/1361-6641/aae001
MLA:
Elogail, Yasmine, et al. "Enhancement of Ge-based p-channel vertical FET performance by channel engineering using planar doping and a Ge/Si x Ge1-x-ySn y heterostructure model for low power FET applications." Semiconductor Science and Technology 33.11 (2018).
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