Parasitic Effects in Broadband Chip Modules Based on Multilayer LTCC Technology
Nisznansky M, Ziegler C, Schür J, Schmidt LP, Hocke R, Wohlgemuth O (2003)
Publication Language: English
Publication Type: Conference contribution, Conference Contribution
Publication year: 2003
Conference Proceedings Title: Proceedings of the 33rd European Microwave Conference
Event location: München
Abstract
In
this paper we refer to typical parasitic and spurious effects that must
be considered for the design of broadband modules. We focus on the
discussion of problems like resonances and parasitic propagation modes
which are typical for interconnects realized in a multilayer LTCC
environment. For understanding such effects, full wave
electromagnetic analysis of frequently used interconnects was performed. Then appropriate design measures were taken to avoid these undesirable effects. Further optimization steps on interconnects are described which minimize distortion of high speed digital signals. Resulting optimized interconnect structures can then be used as standard solution with guaranteed electrical performance for particular LTCC processes. Major part of the presented results were verified by measurements.
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How to cite
APA:
Nisznansky, M., Ziegler, C., Schür, J., Schmidt, L.-P., Hocke, R., & Wohlgemuth, O. (2003). Parasitic Effects in Broadband Chip Modules Based on Multilayer LTCC Technology. In Proceedings of the 33rd European Microwave Conference. München.
MLA:
Nisznansky, Martin, et al. "Parasitic Effects in Broadband Chip Modules Based on Multilayer LTCC Technology." Proceedings of the 33rd European Microwave Conference, München 2003.
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