Simulator Sick but Still Immersed: A Comparison of Head-Object Collision Handling and Their Impact on Fun, Immersion, and Simulator Sickness

Ziegler P, Roth D, Knots A, Kreuzer M, Von Mammen S (2018)

Publication Type: Conference contribution

Publication year: 2018

Publisher: Institute of Electrical and Electronics Engineers Inc.

Pages Range: 743-744

Conference Proceedings Title: 25th IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2018 - Proceedings

Event location: Reutlingen DE

ISBN: 9781538633656

DOI: 10.1109/VR.2018.8446221

Abstract

We compared three techniques for handling head-object collisions in room-scale virtual reality (VR). We developed a game whose mechanics induce such collisions which we either addressed (1) not at all, (2) by fading the screen information to black, or (3) by restricting translation, i.e. correcting the virtual offset in such a way that no penetration occurred. We measured these conditions' impact on simulator sickness, fun, and immersion perception. We found that the translation-restricted method yielded the greatest immersion value but also contributed the most to simulator sickness.

Authors with CRIS profile

Daniel Roth

Involved external institutions

Julius-Maximilians-Universität Würzburg DE Germany (DE)

How to cite

APA:

Ziegler, P., Roth, D., Knots, A., Kreuzer, M., & Von Mammen, S. (2018). Simulator Sick but Still Immersed: A Comparison of Head-Object Collision Handling and Their Impact on Fun, Immersion, and Simulator Sickness. In Frank Steinicke, Bruce Thomas, Kiyoshi Kiyokawa, Greg Welch (Eds.), 25th IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2018 - Proceedings (pp. 743-744). Reutlingen, DE: Institute of Electrical and Electronics Engineers Inc..

MLA:

Ziegler, Peter, et al. "Simulator Sick but Still Immersed: A Comparison of Head-Object Collision Handling and Their Impact on Fun, Immersion, and Simulator Sickness." Proceedings of the 25th IEEE Conference on Virtual Reality and 3D User Interfaces, VR 2018, Reutlingen Ed. Frank Steinicke, Bruce Thomas, Kiyoshi Kiyokawa, Greg Welch, Institute of Electrical and Electronics Engineers Inc., 2018. 743-744.

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