S-EHRFEM - Substrate Extraction using Highly Reduced FEM-meshes for Transient SPICE-simulation with Iterative Linear Solvers
Schade A, Klotz F, Jahn S, Weigel R (2019)
Publication Type: Conference contribution
Publication year: 2019
Publisher: Institute of Electrical and Electronics Engineers Inc.
Pages Range: 812-819
Conference Proceedings Title: EMC Europe 2019 - 2019 International Symposium on Electromagnetic Compatibility
Event location: Barcelona
ISBN: 9781728105932
DOI: 10.1109/EMCEurope.2019.8872008
Abstract
The nouveau S-EHRFEM approach to substrate extraction is based on a mathematical technique which strongly reduces the FEM-discretized Laplace equation in three dimensions. It reduces the nets by almost two orders of magnitude and the resistors by roughly one order of magnitude at an error bound < 10%. This translates into over an order of magnitude speedup of a transient circuit simulation using GMRES. The resulting model is reciprocal, reference-independent, charge-conserving and, under some weak assumptions, passive. This guarantees simulation stability and accuracy.
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Germany (DE)How to cite
APA:
Schade, A., Klotz, F., Jahn, S., & Weigel, R. (2019). S-EHRFEM - Substrate Extraction using Highly Reduced FEM-meshes for Transient SPICE-simulation with Iterative Linear Solvers. In EMC Europe 2019 - 2019 International Symposium on Electromagnetic Compatibility (pp. 812-819). Barcelona, ES: Institute of Electrical and Electronics Engineers Inc..
MLA:
Schade, Alexander, et al. "S-EHRFEM - Substrate Extraction using Highly Reduced FEM-meshes for Transient SPICE-simulation with Iterative Linear Solvers." Proceedings of the 2019 International Symposium on Electromagnetic Compatibility, EMC Europe 2019, Barcelona Institute of Electrical and Electronics Engineers Inc., 2019. 812-819.
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