Schirmer J, Eisen K, Reichenberger M, Roudenko J, Neermann S, Franke J (2018)
Publication Type: Conference contribution
Publication year: 2018
DOI: 10.1109/ICMID.2018.8526939
APA:
Schirmer, J., Eisen, K., Reichenberger, M., Roudenko, J., Neermann, S., & Franke, J. (2018). Long-Term Behavior of SMT Components Mounted on Printed Polymer Thick Film Pastes. In IEEE (Eds.), Proceedings of the 13th International Congress Molded Interconnect Devices (MID).
MLA:
Schirmer, Julian, et al. "Long-Term Behavior of SMT Components Mounted on Printed Polymer Thick Film Pastes." Proceedings of the 13th International Congress Molded Interconnect Devices (MID) Ed. IEEE, 2018.
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